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July 2023

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For Inside Packaging’s summer issue, we’ll be speaking to packaging converting experts about the latest advances being made within the sector. We’ll also explore how the use of artificial intelligence in the digital printing process is improving the supply chain as well the importance of building a digital environment ecosystem with different machine manufacturers.

EDITORIAL

Managing Editor | Laura Husband  

Editor |Mohamed Dabo 

Editor - Thematic Take | Lara Virrey

Feature Writer | Ryan Ellington  

Journalists | Claire Jenns, Isatou Ndure  

Graphic Designers | Noemi Balint, Anett Arc, Will Ingham

Publisher | Susanne Hauner

ADVERTISING

Sales Manager | Tom McCormick
+44 207 8669440

Cover image credit: John D. London via Shutterstock

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Read past issues of Inside Packaging here

Go to article: Home | Solving flexible packaging’s biggest challengeGo to article: Editor's letterGo to article: ContentsGo to article: LoadhogGo to article: BriefingGo to article: News in NumbersGo to article: Latest NewsGo to article: Latest DealsGo to article: Project UpdatesGo to article: Rahn Company InsightGo to article: RahnGo to article: In DepthGo to article: Label production 4.0Go to article: Unwrapping supply chain traceability Go to article: Why isn’t Europe investing more in recycling plastic? Go to article: Solving flexible packaging’s biggest challengeGo to article: Packaging executives’ five key concerns Go to article: BericapGo to article: Thematic TakeGo to article: Thematic Take: contentsGo to article: ForewordGo to article: An introduction to cloud computingGo to article: A history of cloud computingGo to article: The impact of cloud computing on the packaging industryGo to article: Applications of cloud computing in the packaging industryGo to article: Latest news: cloud in packagingGo to article: Q&A with GlobalData thematic analystGo to article: Cloud solutions for packaging supply chains Go to article: Using cloud tech to level the playing fieldGo to article: Leading packaging companies in the cloud computing themeGo to article: Deal activity related to cloud in the packaging industry since 2020 Go to article: Cloud hiring trends in the global packaging industry since 2020Go to article: Cloud patent applications in the global packaging industry since 2020Go to article: Mentions of cloud in packaging industry company filings since 2020Go to article: GlobalData Thematic IntelligenceGo to article: Pharma Sponsored SupplementsGo to article: ListingsGo to article: Excellence Awards 2022 – Winners Announced! Go to article: Buyer's GuidesGo to article: Next issue